DoMicro BV attended SEMICON Taiwan 2018, September 5-7th

Submitted by DoMicro on Thu, 11/08/2018 - 15:30

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At the Holland High Tech Pavilion, DoMicro showed recent advancements on flexible hybrid electronics research & development. Together with our partner SpeedFAM Inc., DoMicro presented advanced new technology and solutions for RDL/TSV for advanced packaging applications by inkjet printing technology.

SpeedFAM is anindependent subsidiary of the world-renowned multinational corporation SPEEDFAM Group, a leader in global precision planar planarization technology and equipment. http://www.speedfam.com.tw