Semicon Taiwan

DoMicro BV attended SEMICON Taiwan 2018, September 5-7th

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At the Holland High Tech Pavilion, DoMicro showed recent advancements on flexible hybrid electronics research & development. Together with our partner SpeedFAM Inc., DoMicro presented advanced new technology and solutions for RDL/TSV for advanced packaging applications by inkjet printing technology.

SpeedFAM is anindependent subsidiary of the world-renowned multinational corporation SPEEDFAM Group, a leader in global precision planar planarization technology and equipment. http://www.speedfam.com.tw

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Representatives Holland High Tech Booth and Silicon Europe
DoMicro BV in a combined presentation with SpeedFAM
©DoMicro Bare die FAN IN contacting
©DoMicro Bare die interconnect FAN OUT
©DoMicro Bare die FAN IN contacting
Applications: 
Track & trace
Quality measurement
Usage measurement
Materials: 
Components
Inks
Isolators
Paper & carton
Foils
Textile
Others
Sector: 
Healthcare
Lifestyle
Logistics
Manufacturing
Packaging
Other
Technology: 
Printing